TSMC announced that its seven-nanometer plus (N7+), the industry’s first commercially available Extreme Ultraviolet (EUV) lithography technology, is delivering customer products to market in high volume. The N7+ process with EUV technology is built on TSMC’s successful 7nm node and paves the way for 6nm and more advanced technologies.
The N7+ volume production is one of the fastest on record. N7+, which began volume production in the second quarter of 2019, is matching yields similar to the original N7 process that has been in volume production for more than one year.
N7+ is also providing improved overall performance. When compared to the N7 process, N7+ provides 15% to 20% more density and improved power consumption, making it an increasingly popular choice for the industry’s next-wave products. TSMC has been quickly deploying capacity to meet N7+ demand that is being driven by multiple customers.
EUV technology enables TSMC to keep driving chip scaling as the shorter wavelength of EUV light is better able to print the nanometer-scale features of advanced technology designs. TSMC’s EUV tools have reached production maturity, with tool availability reaching target goals for high-volume production, and output power of greater than 250 watts for day-to-day operations.
Building on its successful experience, N7+ sets a path for future advanced process technologies. TSMC will bring N6 technology into risk production in the first quarter of 2020 for volume production by the end of the year. With further application of EUV, N6 will offer 18% higher logic density over N7, and design rules fully compatible with N7 enable customers to greatly shorten time-to-market.
More information at www.tsmc.com
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