Synopsys 3DIC compiler for multi-die systems

April 29, 2020 //By Peter Clarke
Synopsys launches 3D design compiler
Synopsys Inc. has launched its 3DIC Compiler for 2.5 and 3D multi-die systems in packages.

The software is based on Synopsys Fusion design platform and provides 3D viewing capabilities as well as integration with Ansys' software for system-level signal, power, and thermal analysis.

One of the inhibitions on the uptake of 3D design to date has been the lack of EDA software.

3DIC Compiler provides architectural exploration, design, implementation, and signoff with signal, power, and thermal integrity optimizations, all in one solution.

"Synopsys' 3DIC Complier with its unified platform is an industry disruptor in how advanced multi-die packages are designed, as it has redefined the conventional tool boundaries across the full design workflow for 2.5D/3D multi-die solutions," said Jaehong Park, executive vice president of Design Platform Development at Samsung Electronics, in a statement issued by Synopsys.

Packaging, 3D architectures and low latency memory are being used to bypass the slowdown in Moore's Law and re driving such developments as chiplets and stacked-die. These come with thousands of inter-die interconnects that are beyond the scope of traditional PCB-based packaging tools.

Synopsys' 3DIC Compiler is built on an IC design data model – enabling scalability in capacity and performance with more modern 3DIC structures. Synopsys has partnered with Ansys to integrate RedHawk family of silicon-proven analysis capabilities with 3DIC Compiler.

Related links and articles:

www.synopsys.com

www.ansys.com

News articles:

Synopsys above ARM in IP licensing revenue in 2019

Synopsys buys Invecas analog IP assets

Ansys to acquire EDA firm with Greek connections


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