Sondrel tapes out largest chip design: Page 2 of 2

November 04, 2020 //By Ally Winning
Sondrel has just completed the tape-out of its largest chip design with over 30 billion transistors, 40 million flipflops, and 23 thousand I/O, power and ground pads.
Sondrel has just completed the tape-out of its largest chip design with over 30 billion transistors, 40 million flipflops, and 23 thousand I/O, power and ground pads.

run as a unit on a dedicated computer farm that comprised 25 computers, each with 24 CPUs and 1.5 Terabytes of memory. Over 100 software licenses were required to perform physical validation checks, which took two days.

We are one of the few digital design companies that can handle a design of this size and complexity, and we have several more nearing completion,” said Graham Curran, Sondrel’s CEO and Founder. “A key part of this is our experience of managing the logistics of having teams in seven different locations and co-ordinating their work. For example, our teams in India and China work in the evenings to maximise the overlap with our teams in Europe.”

More information

www.sondrel.com

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