Samsung certifies Analog FastSPICE Platform from Siemens

January 22, 2021 //By Jean-Pierre Joosting
Samsung certifies Analog FastSPICE Platform from Siemens
Analog FastSPICE™ tools for the verification of analog/mixed-signal circuits from Siemens for early design starts on 3nm GAA process technology.

Tools for the verification of analog/mixed-signal (AMS) circuits from Siemens are now qualified for early design starts on Samsung Foundry’s latest 3nm Gate All Around (GAA) process technology. With this certification, customers can now verify their early-stage AMS designs using the Analog FastSPICE™ (AFS) platform on Samsung’s most advanced process technology. The 3nm GAA platform is engineered to reduce total silicon size, use less power and improve performance over previous process nodes.

“The combined expertise of Samsung Foundry and Siemens provides designers the ability to develop and quickly verify innovative ICs for a variety of high-growth markets and applications,” said Sangyun Kim, Vice President of Foundry Design Technology Team at Samsung Electronics.

With this new certification, the AFS platform is now enabled in Samsung Foundry’s device models and design kits. Mutual customers rely on the AFS platform to deliver nanometer-scale SPICE accuracy while verifying analog, RF, mixed-signal, memory, and custom digital circuits faster than with traditional SPICE simulators.

“With its newest process, Samsung Foundry continues to deliver highly innovative technology for the manufacture of the most sophisticated of IC designs,” said Ravi Subramanian, Ph.D., Senior Vice President, IC Verification Solutions, Siemens Digital Industries Software.

www.sw.siemens.com


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