SABIC is introducing two new grades in its portfolio of Superflow ULTEM™ resins that address the trend of electronic component miniaturization to enable smaller, lighter and more-sophisticated devices. Glass fiber-reinforced Superflow ULTEM SF2250EPR and SF2270 resins feature exceptional flow properties for molding burn-in test sockets (BiTS) used to stress-test ICs. They can also potentially be used to mold thin-wall, high-precision, miniaturized connectors. Their signature flow properties help meet the challenges of complete mold filling and easy release in ever-smaller components.
Balancing flow with toughness, Superflow ULTEM SF2250EPR and SF2270 resins are excellent alternatives to incumbent materials such as glass fiber-reinforced liquid crystal polymers (LCPs) and polyethersulfone (PES) resins. They deliver greater weld line strength and mechanical performance than LCPs, and higher tensile strength and modulus, higher weld line strength and lower moisture absorption than PES resins.
“As electronic components such as IC chips and onboard connectors shrink in size and weight to support new generations of mobile and wearable devices, there is a need for novel materials offering optimized performance and consistent quality in miniaturized configurations,” said Tsutomu (Tom) Kinoshita, senior business manager, SABIC. “These requirements apply both to connectors and burn-in test sockets used to test the performance and reliability of IC chips for higher-speed and higher-density interconnections required by smart electronics. The expansion of our Superflow ULTEM resin portfolio addresses evolving industry trends and demonstrates SABIC’s continued investment in new technologies for the electronics industry.”