The new controller is built on the company’s proprietary silicon-on-thin-buried-oxide (SOTB) process technology. The new RE01 Group embedded controller has 256 kbyte flash as opposed to the original 1.5 Mbytes (MB) variant that has already been released. The device is available in a 3.16 mm × 2.88 mm WLBGA package size, and it has been optimized for use in small product design in IoT applications.
The new controller has gained a certified ULPMark-CoreProfile (CP) score of 705 from EEMBC, to demonstrate the energy efficiency of the device. The Renesas’ SOTB process technology provides lower energy use in both active and standby current consumption. The controller has current consumption down to 25 μA/MHz in operation and as low as 400 nA in standby. The current consumption can be reduced further to 12 μA/MHz by using Renesas’ ultra-low Iq ISL9123 as an external step-down regulator.
“We are very pleased that the RE Family embedded controller’s ultra-low power consumption was officially certified,” said Hiroto Nitta, Senior Vice President, Head of SoC Business, IoT and Infrastructure Business Unit at Renesas. “We hope that this will lead to a wider adoption of the RE family, expanding the battery life of embedded devices and relieving more customers of their battery maintenance burden.”
The new RE01 Group R7F0E01182xxx provides:
Arm Cortex-M0+ core with maximum operating frequency of 64 MHz
256 KB flash and 128 KB SRAM
Operating current: 25 µA/MHz (when using on-chip LDO), 12 µA/MHz (when using external DC/DC converter)
Software standby: 400 nA
Operating voltage range: 1.62V - 3.6V with high-speed operation of up to 64 MHz from 1.62V
Package lineup: approx. 3 mm square 72-pin WLBGA, 7 mm square 56-pin QFN, 14 mm square 100-pin and 10 mm square 64-pin LQFP
On-chip energy harvesting control circuit (fast boot condenser charging, secondary battery charge protection functionality)
Approximately 4 µA ultra-low power-consumption and 14-bit A/D converter
Support for flash programming on approximately 0.6 mA of power