PICMG COM-HPC approves high-performance CoM pinout specs

November 15, 2019 //By Julien Happich
Computer-on-Module
Congatec announced that the PICMG COM-HPC technical subcommittee approved the pinout of this new high-performance Computer-on-Module specification.

The new COM-HPC standard is now entering the home stretch for the ratification of version 1.0 of the specification, scheduled for the first half of 2020. Computer-on-Module manufacturers and carrier board designers who are active in the COM-HPC workgroup can now embark on first edge computing designs based on this pre-approved data, with the expectation to bring them to market in time with the launch of new high-end embedded processor generations from Intel and AMD next year.

“Within PICMG we are currently working on the next generation Computer-On-Module standard which is of utter importance for the embedded and edge computing world. Next to the physical footprint, the pinout is the most essential milestone. It could only be pre-approved so quickly because all key market players, including semiconductor manufacturers such as Intel, gathered around one table in the COM-HPC technical subcommittee, also making sure that the standard will be the best fit possible for future processor generations”, said PICMG president Jessica Isquith.

With the adoption of the pinout, all committee members now have a solid working basis from which to offer interfaces supporting up to 100 GbE and PCIe Gen 4.0 and Gen 5.0 as well as up to eight DIMM sockets and high-speed processors with more than 200 watts on standardized COM-HPC modules, and to work on standard-compliant carrier board designs.

Congatec - www.congatec.com/COM-HPC


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