SMART Modular Technologies, a subsidiary of SMART Global Holdings, Inc., has introduced a new line of PCIe NVMe solid state drive (SSD) Flash products designed for industrial embedded applications. The new BGAP520 PCIe NVMe family of products in M.2 Type 1620 BGA package (BGA NVMe) and small form-factor M.2 2230 single-sided module is ideal for embedded systems where space constraints are a key design consideration.
BGAP520 PCIe NVMe is the latest addition to SMART Modular’s portfolio of DuraFlash™ products to deliver durable and reliable Flash storage to the industrial embedded market segment. DuraFlash-branded products are built to high standards to withstand the harshest operating environments including extreme hot and cold temperatures, vibration, humidity, salty air, dust and exposure to sulfur dioxide.
The Type 1620 BGA NVMe and M.2 2230 PCIe NVMe modules address the need for soldered down and small form factor Flash storage in embedded systems. The products utilize a PCIe Gen 3 x4 interface and comply with the NVM Express v1.3 protocol standard. They are available in 3D NAND tri-level cell (TLC) in commercial temperature (0 °C to 70 °C) in 30 GB to 240 GB and pseudo single-level cell (pSLC) industrial temperature (-40 °C to 85 °C) in 20 GB to 80 GB versions.
The SMART BGAP520 BGA NVMe and M.2 2230 products are built with the latest controller and 3D NAND technology. They support PCIe Gen3 x 4 and comply with NVMe v1.3 specifications. The BGA NVMe conforms to the M.2 Type 1620 BGA package standard, while the M.2 2230 module conforms to the M.2 2230 S2-M module standard.
“At SMART, we’ve developed state-of-the-art solutions for businesses that embed memory and storage into their technology,” said Victor Tsai, director of Flash Products, SMART Modular. “With the BGAP520 PCIe NVMe products in Type 1620 BGA package and M.2 2230 module, designers can count on robust and ruggedized Flash memory with unrivalled performance.”