Partnership on mobile 3D depth sensing camera

November 21, 2018 //By Julien Happich
Partnership on mobile 3D depth sensing camera
Sensor solutions manufacturer ams announced a partnership with Qualcomm Technologies to jointly develop a 3D depth sensing camera solution for mobile phone applications like 3D imaging and scanning and, in particular, biometric face authentication.

With ams' advanced VCSEL light sources and optical IR pattern technology incorporating mass-production proven wafer level optics and Qualcomm's Snapdragon Mobile Platforms, the two companies aim to deliver a reference design for a cost-attractive, active 3D stereo camera solution for Android-based mobile phones.

Use cases for the platform solution could include front-facing applications that require advanced 3D imaging such as face recognition required for secure online payments as well as other applications like dynamic-depth facial scanning.

"Qualcomm Technologies is committed to providing active depth camera solutions to our customers," said Keith Kressin, senior vice president, product management, Qualcomm Technologies, Inc. "We're excited to work with ams on the development and commercialization of this reference design with the goal of bringing these depth sensing solutions to consumers in the future."

ams -  www.ams.com

Qualcomm Technologies - www.qualcomm.com


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