NOR+NAND dual-die memory now supports NXP Layerscape LS1012A
The board is intended for use with NXP’s Layerscape LS1012A communications processor.
Winbond’s W25M161AW SpiStack chip is available in an 8mm x 6mm package and integrates 16Mbit NOR flash and 1Gbit of NAND. The stacked-die construction of the chip and Chip Select software from Winbond integrate a serial NOR Flash die for fast boot and a serial NAND die for high memory density in an 8-terminal WSON package.
Winbond’s has also developed a high-performance serial NAND technology to support a two-chip dual-quad interface to bring a maximum data rate of 166MB/s – four times faster than existing serial NAND memories.
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