The EV Group (EVG) has launched a maskless lithography system for high-volume manufacturing (HVM) with a 5x increase in throughput compared to existing maskless exposure systems.
The Austrian group supplies wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets. The Lithoscale system is the first to use EVG's MLE (Maskless Exposure) solid state laser technology.
Lithoscale was developed for applications requiring a high degree of flexibility or product variation, including advanced packaging, MEMS, biomedical and IC substrate manufacturing. It combines a resolution under 2μm with no exposure field limitations, digital processing for real-time data transfer and immediate exposure, and a highly scalable design.
The ability to generate a stitch-free pattern for interposers exceeding current reticle sizes is especially useful for advanced devices with complex layouts needed for advanced graphics processing, artificial intelligence (AI) and high-performance computing (HPC). It also uses dynamic alignment modes and die-level compensation with automatic focus to adapt to substrate material and surface variations and maintain optimal overlay performance. LITHOSCALE accommodates a variety of substrate sizes and shapes, up to 300-mm-diameter wafers as well as rectangular substrates up to quarter panels, as well as different substrate and resist materials.
"Lithoscale is a major achievement for EVG and firmly establishes our technical leadership in lithography while opening the door to a new world of opportunities for digital lithography," stated Paul Lindner, executive technology director at EV Group. "It has been designed from the ground up to be a highly flexible and scalable platform, which enables high-volume device manufacturers to finally realize the benefits of digital lithography. Demonstrations with our customers and partners have shown that the applications that can benefit from Lithoscale are wide ranging and growing by the day."
Shipments will start later this year.
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