Faster data transfer helps future-proof control systems. The platform is built on 1 Gigabit architecture with communications supporting Device Level Ring (DLR), linear and star topologies.
FLEX 5000 I/O modules also help improve productivity by simplified wiring and design. A flexible architecture includes vertical and horizontal mounting and copper and fibre media options. The modules are designed to operate in -40 C to 70 C temperatures.
Removal and insertion under power (RIUP) allows the replacement of I/O, and an online change capability allows configuration of new I/O while the system continues to run. A wide range of safety modules will be available for the FLEX 5000 I/O platform in a future release, including modules that are TÜV certified for use in SIL 3 and PLe, Cat. 4 applications.