With some echoes of the days of Pentium II, which came in a slot-based multi-chip module – but much updated to current technology – the mobile-computing-oriented multi-chip module uses a technology Intel is calling EMIB. Embedded Multi-die Interconnect Bridge appears to be a high-speed data path, or perhaps an interposer (but not, says the Intel video clip, a ‘standard interposer’), integrated in the multi-chip substrate to tightly couple the processor core and the graphics chip. Also on the same high-speed interconnect is a vertical stack of graphics memory chips.
The combination is pitched as providing a high-performance but thinner package to offer more advanced graphics in smaller, lighter portable platforms, with Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel, third-party discrete graphics chip from AMD’s Radeon Technologies Group – all in a single processor package. An AMD spokesman describes the graphics chip as a “semi-custom” impementation, developed with and specific to, the Intel module.
The design and packaging innovations, Intel asserts, reduce silicon footprint by more than 50%, and enable real time power sharing across CPU and GPU for best performance.