The communications options include 12 multi-gigabit transceivers, each with a data transfer rate of up to 12.5 Gbit/sec. There are also interfaces available for USB 3.0, PCIe Gen3 x8 and Gigabit Ethernet. The module offers up to 4 GByte DDR4 SDRAM with ECC for higher data throughput with guaranteed integrity. It is available in both commercial and industrial temperature ranges, and only needs a single 5-15 V supply for operation.
Situated on a Mercury+ PE1-300 or Mercury+ PE1-400 baseboard, the Mercury+ AA1 offers a powerful development and prototyping platform. The platform is further expandable through the LPC/HPC FMC connectors on the PE1 baseboard, which are compatible with a wide range of plug-in cards from various manufacturers.
The AA1 comes with all the hardware, software and support materials required, including detailed documentation and reference designs to make it simple to get started. In addition to the user manual, schema, a 3D-model (STEP), PCB footprint Footprint (Altium®, OrCAD, PADS, EAGLE) and differential I/O length tables are provided.
The Enclustra Build Environment can compile the Enclustra SoC modules with an integrated ARM processor very smoothly. Both module and base board are selected by a GUI. After, the Enclustra Build Environment downloads the appropriate Bitstream, Bootloader and source code. Finally, U-Boot, Linux and the root file system, which is based on BusyBox, are compiled.
The family concept with compatible connectors, different types of modules can be used on the same base board, such as the Intel Cylcone V SoC-based Mercury SA1 or Mercury+ SA2.