Industrial-grade embedded SIM comes in a WLCSP
The chip provides a high-end feature set fully compliant with the latest GSMA specifications for eSIM. Deploying eSIM brings a number of advantages for a smooth adoption of cellular connectivity into industrial environments. Device manufacturers can increase their design flexibility due to the eSIM’s small footprint, and simplify manufacturing processes as well as global distribution thanks to a single stock-keeping unit. Customers also have the possibility to change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from the mobile operator. The SLM 97 security chip in WLCSP is manufactured at Infineon’s production site in Dresden and Regensburg and now available in volume quantities.
Infineon – www.infineon.com
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