IC/package co-design EDA tool offers end-to-end optimization: Page 2 of 2

January 12, 2021 //By Jean-Pierre Joosting
IC/package co-design EDA tool offers end-to-end optimization
Holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies.

GENIO's holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system. It has proven to be very application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.

The result is right-the-first-time concept-to-design methodology, thanks to strong "what-if" analysis and system level exploration across architectures. GENIO™ identifies the most proficient solution and avoids entering "dead-end" architectures/design roads.  At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.

GENIO™ also eliminates design environment boundaries to enable system architectural exploration that identifies errors and bottleneck early in the design process. It also features cross-hierarchical pathfinding for pin assignment optimization, wire lengths/crossovers reduction, and floor planning-aware silicon interposer design.

www.monozukuri.eu

 

Further reading

The acceleration of design automation to the cloud in 2020
RTL simulation acceleration for Microchip FPGAs
Chip verification industry could benefit from software techniques


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