IC/package co-design EDA tool offers end-to-end optimization

January 12, 2021 //By Jean-Pierre Joosting
IC/package co-design EDA tool offers end-to-end optimization
Holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies.

According to MZ Technologies, several key IC/package co-design features are critical to meeting today's high-performance advanced technology IC device EDA needs.  The company's GENIO™ IC/package co-design EDA tool claims to be the only end-to-end optimized solution that covers all the requirements.

Visionary IC systems designers have identified seven key features that should be incorporated into the ideal integrated IC/package co-design tool. These include: IC, package PCB design environment support, system-level I/O planning and optimization, a holistic design environment, mixed silicon and photonics, interconnect optimization, open standards, and tool agnostic work flows.  

GENIO™ is the only EDA tool that provides all seven, integrating silicon and package EDA flows to create a full co-design and end-to-end optimized design environment for complex multi-chip designs that comprise advanced heterogeneous microelectronic systems. 

"The IC/packaging co-design tool segment today is swiftly maturing, but none of the big 3 have yet to offer an optimized end-to-end solution. Because we imagined and built the technology platform from the ground up, GENIO™ is architected from a 'design first' rather than a 'proprietary technology first' perspective," explained Anna Fontanelli, Founder and CEO of MZ Technologies.  


GENIO is the industry’s only end-to-end optimized IC/package co-design tool and has proven to eliminate significant systems design inefficiencies.


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