High-speed IP connects secure MCUs to Xilinx products

February 25, 2019 //By Ally Winning
High-speed IP connects secure MCUs to Xilinx products
At Embedded World, Infineon, Xilinx and Xylon will present new IP to enable high-speed communication between Infineon’s AURIX TC2xx and TC3xx MCUs and Xilinx’ devices using High-Speed Serial Link (HSSL).

The logiHSSL Xylon IP supports baudrates of up to 320 Mbaud at a net payload data-rate of up to 84%.

HSSL is an Infineon native interface that requires only five pins – two LVDS with two pins each and one clk pin. The new IP core will allow the combination of AURIX safety and security with a wide range of Xilinx devices. Linked devices can access and control each other’s internal and connected resources through HSSL.

The core will be supported by a starter kit, which includes a Xilinx evaluation kit, an Infineon AURIX evaluation board and a Xylon FMC board. Kit deliverables include the reference design with the test software application, Xylon’s logicBRICKS evaluation licenses, documentation and technical support.

Embedded World

Infineon 3A 231

EBV 3A 229

More information


Related news

Hitex eases coding for Infineon's AURIX Multicore architecture

Axivion and Bosch sign global framework agreement

Infineon moves AURIX automotive processors to next-generation

Embedded profiler with architectural insight optimizes software on Infineon AURIX

Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.