High-density DDR4 range expanded to 16GB

April 17, 2020 //By Ally Winning
SMART Modular Technologies has added to its range of high density DDR4 Module-in-a-Package (MIP) for IIoT and embedded computing applications.
SMART Modular Technologies has added to its range of high density DDR4 Module-in-a-Package (MIP) for IIoT and embedded computing applications.

The latest package expands the MIP density of the range to 16GB. SMART’s MIP is a small form factor solution intended to maximise DRAM capacity within space-constrained applications.

The 16GB MIP has a standard 1Gx64 version or a two channels x32 configuration to replace either soldered down DRAMs or SO-DIMMs. MIPs are an ideal solution for MCU, CPU, or FPGA-based embedded computing systems that require a x64 or x32 memory access.

SMART offers a full lineup of MIPs from 4GB to 16GB with speeds up to DDR4-3200.

More information

www.smartm.com/mip

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