The performance specifications of the the 64 Mb HyperRAM™ include maximum data bandwidth of 500MB/s. It also offers ultra-low power consumption in operating and hybrid sleep modes.
Jason Zhu, CEO of Gowin, said: ‘The problem which Gowin Semiconductor has solved with the GW1NSR4 is to pack a high-performance and low-power edge computing engine in a tiny package. The Winbond KGD format and HyperRAM™ memory technology are ideal for this, because the die can be embedded in the same package as the FPGA, eliminating the need for DRAM as an external component.
Winbond’s HyperRAM™ products are available for high-volume production in densities of 512 Mb, 256 Mb, 128 Mb, 64 Mb and 32 Mb.