The XinaBox range offers a cost-effective entry into IoT, AI, ML and automation. It combines STEM learning and the physical computing experience for students. XinaBox is also ideal for beta testing and prototyping new applications.
XinaBox is suitable for developers of all ages and experience. XinaBox kits include a selection of xChips, which have been designed to speed up the understanding of new technologies. xChips are clipped together without wires, soldering or breadboards.
There is a selection of over 80 modular hardware XinaBox xChips that include cores/CPUs, sensors, power, communication, output and storage. Wi-Fi, Bluetooth and LoRaWAN cores make IoT connectivity simple. Other boards, such as the BBC micro:bit and Raspberry Pi, can be easily integrated add more power and flexibility to projects. xChips can operate with pre-compiled code or can be programmed from scratch using platforms such as MakeCode, Arduino and Python.
XinaBox kits available from Farnell include:
• XK01 STEM Starter Kit: Enables the building of simple projects and connection to an IoT platform with a quick start guide. The kit includes a Wi-Fi Core, xChip (ESP8266) and sensors for temperature, humidity, and pressure, UV index, a mini-OLED display, a spacer chip and connectors.
• XK05 micro:bit IoT Kit: The XK05 IoT kit for micro:bit is designed as an introduction to IoT technology. The kit allows analysis of large data sets with no previous experience required. Users can connect the micro:bit to the cloud and build a smart IoT device with the coding extension, MakeCode.
• XK12 IoT Starter Kit: Powered by Zerynth, the XK12 IoT Starter Kit combines modular electronics with an ecosystem of Python software tools. The kit has everything required to build a smart IoT edge device that collects environmental data. An actuator can also be attached.
Lee Turner, Global Head of Semiconductors and SBC at Farnell, said: “XinaBox provides accessible tools to introduce STEM and IoT while providing inspiration for hands-on learning. XinaBox also provides new options to scale beta testing and reduce time to market through its simple, modular, non-solder structure.”