The NK6010 3GPP Rel.14 eNB-IoT SoC is offered as a highly cost and power efficient NB-IoT SoC designed specifically to enable narrowband connectivity in massive IoT devices such as smart meters, wearables, asset trackers, and industrial sensors. Built around the CEVA-Dragonfly NB2 solution, the NK6010 integrates an RF front-end, RF transceiver, cellular baseband, power management unit, and application processor.
The SoC supports all NB-IoT frequency bands and major global carriers, enabling rapid certification of devices on any NB-IoT commercial network around the world. It also includes an extremely low-power multi-GNSS subsystem, supporting GPS/Beidou/Galileo/GLONASS global navigation systems, to ensure highly-accurate device tracking and locating, worldwide.
"We developed NK6010 to meet the exceptional demand for NB-IoT chipsets to power the multitude of new use cases and applications that narrowband cellular connectivity serves," says Dr. Xiaohua Kong, Nurlink CEO. "The CEVA-Dragonfly NB2 enabled us to massively accelerate our time-to-market by providing many of the key building blocks for our SoC design, already silicon proven and pre-integrated."
Michael Boukaya, vice president and general manager of the wireless business unit at signal processing IP provider CEVA, adds, "NB-IoT has reached critical mass, with more than 60 operators around the world already supporting the standard and dozens more launching coverage imminently. Now the drive towards ultra-low-cost NB-IoT chipsets and modules has begun and Nurlink, powered by our CEVA-Dragonfly NB2 IP solution, is one of the early entrants into this fast growing space."
The CEVA-Dragonfly NB2 IP solution is a modular technology, composed of the CEVA-X1 IoT processor, an optimized RF Transceiver, baseband, and a protocol stack to offer a complete Release 14 Cat-NB2 modem IP solution. It is a fully software-configurable solution and can be extended with multi-constellation GNSS and sensor fusion functionality. The IP includes a reference silicon of the complete modem design, including an embedded CMOS RF transceiver and PA, an advanced digital front-end, physical layer firmware, and a protocol stack (MAC, RLC, PDCP,