Created for extremes: ICP Modular Embedded PC: Page 2 of 2

October 16, 2019 //By Wisse Hettinga
Created for extremes: ICP Modular Embedded PC
With 8th Generation Intel® CoreTM I and XEON Processors

There is also space for one Intel i219-LM and one i210-IT GbE LAN port each, six USB 3.0, two USB 2.0, PS/2, two RS-232/422/485, two SIM card holders and three expansion slots for optional MX1 expansion modules. As an expansion module, fourfold LAN with RJ45 with and without PoE+ functionality, fourfold LAN with M12 connector with and without PoE+ functionality, a twofold RJ45 PoE+ module, an isolated fourfold combo RS-232/422/485 and 8-bit DIO interface and a Vehicle Power Ignition module are available. For example, the MX1 can be equipped with ten PoE connections for image processors. The MX1 can withstand ambient temperatures from -40 °C to 70 °C, depending on the CPU type, and can offer additional EN50155 and E-MARK certifications for vehicle and rail operation. With a voltage range from 9 to 48 volts DC, the MX1 covers a very wide range, industrially designed with reverse power control, overvoltage and overcurrent protection.

ICP supplies the MX1 as a ready-to-use system with matching industrial RAMs and storage media to ensure that the extremes can also be exploited.

 

Specifications

  • Fanless Embedded Box PC with LGA1151 socket
  • 8th Generation Intel® CoreTM I and XEON Processors
  • Intel® C246 chipset
  • Max. 32GB DDR4 ECC/NON-ECC SO-DIMM Memory
  • 3x 2,5" drive bays 
  • 1x M.2 2242/2260/2280 M Key, 1x M.2 M2230 E Key
  • 2x mini PCI Express Full Size
  • USB3.0, HDMI, DP, DVI-I, Dual GbE, RS-232/422/485

More information at www.icp-deutschland.de


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