The new enclosure is based on the Xilinx Zynq UltraScale+ RFSoC FPGA. It is ideal for SIGINT and COMINT, military communications, EW countermeasures, radar transceiver, test and measurement, SATCOM, LiDAR, 5G and LTE wireless applications.
“Because Quartz RFSoC products are extremely popular with our customers, we were getting requests to use these Quartz products in harsher environments. The Model 6350 is a self-contained system in an SFF enclosure that allows for deployment in rugged installations." said Bob Sgandurra, director of Product Management of Pentek. He added, "Our QuartzXM eXpress module, the heart of the Quartz family, enables us to quickly adapt to new form factors for our customers. This Model 6350 system provides a ruggedized, weatherized, space-constraint solution to many applications and extends this functionality for pods, UAVs, antenna masts, and other remote or space-constrained installations.”
Optimized for SWaP, the Model 6350 is 3.53” x 5.65” x 9.57” in size and weighs almost 8 pounds. It has been designed for use in harsh environments and is IP67 specified for dust and water immersion. An internal ‘I-beam’ construction creates a chassis that is both rugged and efficient for heat dissipation. The Model 6350 can also be used with an optional fan plate.
The Pentek Quartz simplifies the design for reduced power and cost, while offering the highest performing FPGA resources. The enclosure is supported by Pentek’s Navigator Design Suite tools to provide users with an efficient path for developing and deploying software and FPGA IP for data and signal processing. The Xilinx Zynq UltraScale+ RFSoC Processor includes eight RF-class A/D and D/A converters into the Zynq FPGA fabric along with quad ARM Cortex-A53 and dual ARM Cortex-R5 processors.
Model 6350 comes with a suite of Pentek IP modules pre-installed, which will provide data capture, timing, interface, and processing solutions for common applications. Modules include DMA engines, DDR4 memory controllers, test signal and metadata generators, data packing and flow control. The board