The congatec conga-TCV2 is centred on the Ryzen Embedded V2000 processor. Compared to previous generations, it features double the performance per watt, two times the number of CPU cores and measures only 76% of the previous size on a 100% pin-compatible form factor.
The AMD Ryzen Embedded V2000 SoC uses integrated AMD Radeon graphics, with up to 7 GPU compute units. The performance per watt improvements of the new ’Zen 2’ cores are mainly down to 7nm manufacturing process technology. Architecture optimization also adds an estimated 15% more instructions per clock to this improvement.
“With up to 16 threads, high performance embedded system designs at the edge can now execute twice as many tasks at given TDP ranges, which is great news for edge computing as more and more parallel tasks occur at the edge. It is also impressive to see integrated graphics performance continues to offer outstanding 3D graphics quality on up to four independent 4k60 displays. All this comes in scalable TDP classes ranging from 54 Watt down to extremely low-power configurations consuming as little as 10 Watt,” explains Martin Danzer, Director of Product Management at congatec.
“We are pleased to work with congatec in launching the Ryzen Embedded V2000 series based Computer-on-Module (COM) Express modules,” said Amey Deosthali, Director of Product Marketing, Embedded Business Group, AMD. “COM Express Type 6 form factors from congatec offer cutting-edge graphics and outstanding CPU performance based on our new AMD Ryzen™ Embedded V2000 processors.”
The new conga-TCV2 high-performance COM Express Compact modules with Type 6 pinout have 4 different processor options.
The modules have 4MB L2 cache, 8MB L3 cache, and up to 32GB 64-bit DDR4 memory with up to 3200 MT/s and ECC support for maximum data security. The integrated AMD Radeon graphics have up to 7 compute units.
The conga-TCV2 Computer-on-Module is able to support up to four independent displays with up to 4k60 UHD resolution over 3x DisplayPort