Collaboration aims to deliver power to future processors

April 17, 2019 //By Julien Happich
Vicor Corporation announced it will collaborate with Kyocera Corporation on the development of next-generation Power-on-Package (PoP) solutions to maximise performance and minimise time-to-market for emerging processor technologies.

In this cooperation, Kyocera is to provide the integration of power and data delivery to the processor with organic packages, module substrates and motherboard designs. Vicor will provide Power-on-Package current multipliers to support high density, high current delivery to processors. Vicor’s Power-on-Package technology enables current multiplication within the processor package. Providing current multiplication within the package can reduce interconnect losses by up to 90 percent, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality.

Presented at the NVIDIA GPU Technology Conference 2018 and China ODCC 2018 Summit, Vicor’s advanced Power-on-Package technology enables Vertical Power Delivery (VPD) from the bottom side of the processor. VPD virtually eliminates Power Delivery Network (PDN) losses while maximizing I/O capability and design flexibility.

By utilising its design technology, simulation tools and manufacturing experience, Kyocera provides optimal designs for complex I/O routing, high speed memory routing, and high-current power delivery.

Vicor Corporation -

Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.