Chipset for G3-PLC hybrid powerline and wireless communication

June 01, 2021 // By Jean-Pierre Joosting
Chipset for G3-PLC hybrid powerline and wireless communication
Turnkey powerline/wireless chipset based on field-proven ST8500 programmable multi-protocol SoC and ultra-low-power sub-GHz S2-LP RF transceiver.

The ST8500 and S2-LP chipset from STMicroelectronics has become the first to be certified according to the G3-PLC Hybrid communication standard that defines seamless connectivity over powerline and wireless media.

The G3-PLC Hybrid specification allows smart-grid, smart-city, industrial, and IoT equipment to select the best available wireless or powerline channel at any time, automatically and dynamically, according to network conditions. This enables superior coverage, reliability, and scalability, while also allowing cost-efficient system operation and enabling new use cases.

One of the first Hybrid-ready products, ST demonstrated its ST8500 Hybrid chipset at a G3-PLC Alliance interoperability plugfest in 2020. The chipset is now the first to complete the latest G3-PLC certification scheme, published in March 2021, which incorporates the Hybrid profile tests.

The certified chipset combines the ST8500 programmable multi-protocol powerline communication system-on-chip (SoC) and STLD1 line driver with the S2-LP ultra-low-power sub-GHz radio transceiver. The SoC’s programmability enables a software-defined implementation capable of supporting a broad portfolio of powerline protocol stacks, in worldwide frequency bands such as CENELEC and FCC.


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