The announcement comprises two boards (shields) further extending the company’s recently launched IoT Development Kit (IDK) platform’s capabilities. Two shields now support Bluetooth low energy technology and Smart Passive Sensors (SPS), possible use cases include smart home/building, smart city, industrial automation and mHealth applications.
The Bluetooth low energy shield features the RSL10 multi-protocol Bluetooth 5 certified radio System-on-Chip (SoC), wit low deep sleep current and receive power for extended battery life. The form factor of the RSL10 delivers the ultra-compact, cost effective end designs demanded by low power IoT sensor networks. By integrating the Bluetooth low energy shield with the IDK, customers get a complementary choice of connectivity for extending reach, and sensing and actuator options, including lighting and motors.
The SPS shield extends the IDK to capture data from ON Semiconductor’s battery-free wireless sensors that measure temperature, moisture and pressure. The sensors are suited for industrial and other applications with hard to access areas where zero maintenance is a necessity, and battery replacement is a challenge. Pairing the SPS shield with the IDK enables rapid prototyping of IoT applications that require battery-free sensing and wide area or local connectivity and actuation options.
Both new shields expand the configurable, modular options for sensing, actuation and wired/wireless connectivity of the IDK, giving application designers complete flexibility agnostic of the communication protocol chosen. They promise rapid start-up of projects, allowing developers to deliver data directly into the cloud, thereby enabling value-added services, including analytics.
IDK shields are supplied with full documentation including complete design schematics, PCB layouts and Gerber files to facilitate rapid transition of designs from concept, through development and into production. The industry standard interfaces ensure that current and future modules from ON Semiconductor and other vendors can be seamlessly integrated into designs while the simple ‘cut-and-paste’ approach to end product design reduces R&D time, expense and risk.
ON Semiconductor; www.onsemi.com