AMD and MediaTek develop Wi-Fi 6E modules for PC connectivity

November 19, 2021 // By Jean-Pierre Joosting
AMD and MediaTek develop Wi-Fi 6E modules for PC connectivity
Collaboration offers Wi-Fi 6E modules based on the MediaTek Filogic 330P Wi-Fi 6E chipset to deliver seamless connectivity and longer battery life.

MediaTek and AMD have announced a collaboration to co-engineer industry leading Wi-Fi® products, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s latest Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference from other signals.

To optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe® and USB interfaces for modern sleep states and power management, which are vital elements of modern customer experiences. Further, the optimization process included stress testing and ensuring compatibility standards, which may ultimately reduce development time for OEM customers.

Filogic 330P supports the latest connectivity standards of 2x2 Wi-Fi 6 (2.4-/5-GHz) and 6E (6-GHz band up to 7.125-GHz), along with Bluetooth® 5.2 (BT/BLE). The high throughput chipset is ultra-fast with support for up to 2.4 Gbps connectivity, including support for the new 6 GHz spectrum at 160MHz channel bandwidth. The chipset also integrates MediaTek's power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint which enables the Filogic 330P chipset to be embedded in laptops of all sizes.

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