Siemens, UMC collaborate on process design kits for power chips

Siemens, UMC collaborate on process design kits for power chips
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Siemens collaborates with UMC on process design kits (PDKs) to enable 110 nm and 180 nm BCD power and sensor custom IC design flow.
By Jean-Pierre Joosting

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Siemens Digital Industries Software had developed process design kits (PDKs) for the 110 nm and 180 nm power, sensor and MEMS process technology from United Microelectronics Corporation (UMC). The new PDKs are optimized for Siemens EDA’s Tanner custom design flow software, enabling innovative designs for a wide variety of ICs used in automotive and power applications. 

Siemens’ custom IC design kits built using its Tanner software are now available for UMC’s BCD processes. The 110nm and 180nm BCD platforms are used for power management ICs (PMICs), battery management ICs (BMICs) and wireless and fast charging ICs with designs up to 100 V operating voltage that combine analogue circuits and digital content as well as power devices and embedded NVMs. 

“Dozens of customers’ designs have been verified and entered production in the last few quarters amid robust market demand,” said Cedric Lee, senior division director and chairman of the High Voltage Product Line Management committee at UMC. “With applications becoming more sophisticated, power management solutions are also getting increasingly complex. Innovations such as Edge AI and mobility devices are driving the need for higher performance on shrinking area and low leakage. In collaboration with Siemens, UMC strives to equip our customers with the tools they need to bring their designs to life.” 

The Tanner software has an easy-to-use schematic and layout editor and integrates with circuit simulators and Siemens’ Calibre software for design rule checking, parasitic extraction and physical verification. Tanner has a 30-year track record and has been used to successfully tape out thousands of designs.


 “Through our collaboration with UMC, our mutual customers can adopt the certified process design kit for BCD technologies and start designing immediately with increased productivity,” said Fred Sendig, general manager of the Integrated Circuit Design Solutions group at Siemens Digital Industries Software. “These certified PDKs allow UMC customers to leverage the complete Siemens EDA custom IC design flow, enabling them to design innovative applications with confidence.” 

www.umc.com

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