Pushing Boundaries for Wafer Level Testing

Pushing Boundaries for Wafer Level Testing

Smiths Interconnect has released its Volta Series probe heads, which are designed to quickly and accurately test ICs at the wafer level.
By eeNews Europe


The Volta range is intended to replace cantilever and vertical probe cards in the testing phase. The probe heads have been designed to feature the shortist possible signal path to offer low and stable contact resistance, a larger current capability and a longer usable service life. Plastic and ceramic materials for housing the probes have also been designed to offer increased planarity for highly paralleled testing. The housings have also been designed to be easy to maintain, install and repair.


The key to the Volta series’ performance is the Volta Manual Actuator (Lid) design which can enable the testing of different die sizes at the same time and eliminates die cracking.

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