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LPDDR4/4X 100BGA package achieves JEDEC standard

Business news |
By Jean-Pierre Joosting

Winbond Electronics Corporation has announced that its new package 100BGA LPDDR4/4X has achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.

The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5- x 10-mm. The device is ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce the PCB size for more compact IoT designs.

The LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267 Mbps. It is available in both Single-Die-Package (SDP) with a 2Gb density and Dual-Die-Package (DDP) with a 4Gb density. The higher speed of LPDDR4 1CH x16 4267-Mbps offers improved performance over previous DDR4 x16 3200-Mbps devices, which is especially useful for consumer applications.

Winbond guarantees the LPDDR4/4X product line will be manufactured for at least the next ten years, which is good news for automotive and industrial applications where long design cycles are common practice.

According to Winbond, the company has been developing the memory product market for many years. Winbond have paid great attention to customers’ needs and the development trend of new technologies, and have successfully developed the next generation of LPDDR4/4X by adding the new package 100BGA to fulfil the needs of emerging IoT, consumer, industrial and automotive applications.

Recently, Winbond announced key enhancements to its DDR3 product on the ultra-high-speed performance. Its 1.35-V DDR3 products support 2133-Mbps data rate in both x8 and x16 configurations and are 100% compatible to 1.5-V DDR3.

Winbond’s DRAM roadmap now supports 1Gb-4Gb DDR3, 128Mb-2Gb DDR2, 512Mb-2Gb LP-DDR2, as well as LP-DDR4x, LP-DDR3, LP-DDR, SDRAM interfaces for applications which require DRAM densities of 4Gb or below. Such applications include AI accelerators, IoT, automotive, industrial, telecommunications, WiFi-6, WiFi-6e, xDSL, fiber-optic networks, smart TV, set-top-boxes, IP cameras and many others. Winbond is also adding new wafer capacity in the new fab in Kaohsiung, Taiwan from 2022 Q4 that offers more advanced manufacturing technologies. Currently, Winbond DDR3 shipments comprise 30% of total DRAM revenue and are projected to increase to 50% in 2024. 

www.winbond.com


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