According to MZ Technologies, several key IC/package co-design features are critical to meeting today’s high-performance advanced technology IC device EDA needs. The company’s GENIO™ IC/package co-design EDA tool claims to be the only end-to-end optimized solution that covers all the requirements.
Visionary IC systems designers have identified seven key features that should be incorporated into the ideal integrated IC/package co-design tool. These include: IC, package PCB design environment support, system-level I/O planning and optimization, a holistic design environment, mixed silicon and photonics, interconnect optimization, open standards, and tool agnostic work flows.
GENIO™ is the only EDA tool that provides all seven, integrating silicon and package EDA flows to create a full co-design and end-to-end optimized design environment for complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.
“The IC/packaging co-design tool segment today is swiftly maturing, but none of the big 3 have yet to offer an optimized end-to-end solution. Because we imagined and built the technology platform from the ground up, GENIO™ is architected from a ‘design first’ rather than a ‘proprietary technology first’ perspective,” explained Anna Fontanelli, Founder and CEO of MZ Technologies.
GENIO’s holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system. It has proven to be very application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.
The result is right-the-first-time concept-to-design methodology, thanks to strong “what-if” analysis and system level exploration across architectures. GENIO™ identifies the most proficient solution and avoids entering “dead-end” architectures/design roads. At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.
GENIO™ also eliminates design environment boundaries to enable system architectural exploration that identifies errors and bottleneck early in the design process. It also features cross-hierarchical pathfinding for pin assignment optimization, wire lengths/crossovers reduction, and floor planning-aware silicon interposer design.
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