The SoM features an NXP i.MX8M quad- or dual-core Cortex-A53 64-bit processor, with RAM, flash and power management. It has a QFN-style pin-out with 100 edge-located pads on a 1mm pitch to provide miniaturization, thermal efficiency and EMI performance. The edge-located contact pads assist with inspection and routing, even allowing a two-layer baseboard including a base plane. The ground-plane layout means they effectively ‘float’ into position during reflow, unlike a BGA which sits on its bumps, and may require X-Ray inspection. The 27mm x 27mm package means that they are small enough to avoid warping.
The module’s i.MX8M Mini/Nano processors give a choice of either dual-core (i.MX8M Nano) or quad-core (i.MX8M Mini) 1400/1600MHz ARM Cortex-A53 processor, as well as a separate GPU and Video Codec (Mini only). Modules feature up to 1GB DDR3L RAM, and 4GB eMMC flash, as well as interfaces including CANbus, UARTs, SPI, I²C, Audio, Ethernet, SD, USB Host and Client and MIPI-DSI display. The i.MX8M Nano and Mini processors provide low-energy operation with powerful features, including MIPI-DSI display up to 1080p. Both modules operate in the industrial temperature range from -25°C to +85°C. The QS8M series comes with a dedicated development system, equipped with Linux BSP (Windows 10 IoT and QNX also available)
The QSBASE2 development kit supports design using the module. The QS8M module is soldered down with all the contacts accessible through header locations. The kit is built with a Raspberry Pi-compatible expansion and display connectors to allow Raspberry Pi ‘hats’ and displays to be used for development. Five USB ports (1 client) and Gigabit Ethernet, UART and MIPI-CSI camera connectors are also provided.