EENews Europe

EENews Europe

Post Titles

Hyundai and SOSLAB to develop 3D LiDAR for mobile robots
Sensata partners with Nanoprecise on AI driven predictive maintenance
Quantum computer boosts performance up to 32-qubits
Sensitron and EPC collaborate on 350 V GaN intelligent power module
Cloud-based application security testing on AWS Marketplace
Blaize and Innovatrics provide edge ready facial recognition
Septentrio simplifies and speeds up GNSS/INS integration
Renesas to reopen 300-mm power semiconductors fab
What can ASICs do for the smart cities of the future?
AWS to deliver IBM Software as-a-Service
Nexperia expands Clip-Bonded FlatPower packaged diodes
Barbara IoT raises funding for smart grid digitisation
Reduced size current transducers measure up to 200 A
Micro-transfer printing for hybrid photonics integration
MediaTek unveils AIoT platform stack and chip
EMI shielding and thermal materials protect drones

Automotive-qualified IGBT/SiC module gate-driver boards

MOSFETs raise power density and efficiency
Partnership offers a MIPI A-PHY-compliant camera for ADAS
OTP memory IP based on ground-breaking architecture
Project enables testing of graphene-based sensors
Power modules enable highest power densities
No-code, free-to-use AI/ML platform
ADVA has key role QKD projects to accelerate commercial rollout
Innodisk announces new Edge AI computing focus
Process-agnostic analog IP tackles fab capacity challenges
Codasip adopts tools from Siemens EDA for formal verification
Leopard Imaging, OMNIVISION collaborate on AI imaging
High performance SAR ADCs simplify design
CoreStack, Zeblok in strategic Edge computing partnership
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