The Gen 3 MLX81330 (0.5 A motor drive) and MLX81332 (1.0 A motor drive) smart LIN drivers are fabricated on high-voltage SOI (Silicon On Insulator) technology. The SOI process provides high levels of robustness and function density. It combines analog and digital circuitry for a true single-chip solution that complies with the LIN 2.x/SAE J2602 and ISO 17987-4 specifications for LIN slave nodes.

Besides the integrated motor driver, the solution features extensive I/O capability and a dual MCU architecture. One core is used for communications and the other MCU handles application software.

The high levels of integration found in the MLX81330 and MLX81332 mean a reduced BoM, smaller PCB, simpler product design and faster assembly. As an example, the MLX81332 connects directly to an ECU and can drive up to four phases of a motor, with a maximum current of 1 A per phase, or two phases with a maximum current of 1.4 A. It can drive a 2-wire DC motor, 3-wire BLDC motor or 4-wire bipolar stepper motor, using either sensored or sensorless field-oriented control (FOC) algorithms.

The smart LIN drivers provide 5 x 16-bit PWM timers, 2 x 16-bit timers and a 10bit ADC, along with a differential current sense amplifier and temperature sensors. Over-current, over-voltage and over-temperature detection/protection is also integrated. They can interface to standard external sensors using the most common automotive protocols, such as SPI and SENT.

The integrated processing cores have a common on-chip memory architecture. The application core (MLX16-FX) has access to 32 KB Flash with ECC, 10 KB ROM, 2 KB RAM and 512 byte EEPROM with ECC. The communications processor (MLX4) can access 6 KB ROM and 512 byte RAM.

The embedded motor controller ICs are designed for safety applications according to ASIL-B (ISO 26262).The smart LIN drivers are provided with software that includes the LIN communication stack.

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