Challenges and options for mmWave packaging

November 17, 2020 //By Jean-Pierre Joosting

In this technical discussion, Liam Devlin at PRFI explains the challenges of packaging devices at mmWave frequencies. He goes on to explore the options and techniques available to achieve the best results. Technologies covered include low-cost over-moulded and air-cavity plastic packages, laminate packages, flip-chip mounting, and antenna-in-package.

Lastest Videos


Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.