High-speed backplane connector system gains Direct Mate Orthogonal (DMO) layout
DMO solutions offer system designers flexibility by removing the mid-plane, allowing fabric cards and line cards to mate directly. This system architecture increases airflow and improves thermal efficiencies throughout the chassis. DMO solutions enhance signal integrity via shorter trace lengths and less connector transitions while streamlining the system BOM and optimizing system cost.
Samtec’s ExaMAX DMO system consists of the EBDM-RA series which mates directly with existing EBTF-RA series. Currently both 6 pair x 10 column and 6 pair x 12 column solutions are available. Guide pin and screw mount options are also available. 6 pair x 6 column and 6 pair x 8 column options are under development.
The ExaMAX line of products is optimized for speeds up to 56 Gbps (PAM-4 modulation). Return loss compliance is achieved in both 85Ω and 100Ω systems due to targeting the 92Ω specifications and controlling reflections at all geometry transitions within the connector.
ExaMAX also claims the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stubs are minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment
The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk. Explanatory video clips are available on the product web page.
Samtec; www.samtec.com
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