The DICE architecture breaks up the boot process into layers and creates unique secrets along with a measure of integrity for each layer, automatically re-keying and protecting secrets if malware is present. One of the key benefits of using the secure boot features of the CEC1702 with the DICE standard is that it enables equipment manufacturers to create a chain of trust for multiple loads of firmware, which is especially important for customers concerned with authenticating system-critical commands, such as in applications like power plants or online server databases. The CEC1702 IoT development kit with the DICE architecture helps designers speed up development cycles. The kit comes with a powerful, programmable 32-bit ARM Cortex-M4 Controller and sample code to quickly develop a secure, cloud-connected solution. Certified by Microsoft Azure, customers can develop their product with the confidence that the necessary components to connect to the internet have been vetted and certified. The kit's CEC1x02 development board comes with a Plug-in Module that contains the CEC1702 with integrated cryptography accelerators, saving code space and decreasing time to market. Two headers compatible with MikroElektronika’s extensive library of click boards allow for flexible design requirements. The MikroElektronika Wi-Fi 7 click board, equipped with Microchip’s ATWINC1510-MR210PB IEEE 802.11 b/g/n/module, is optimized for low-power IoT applications. Also part of the kit is the MikroElektronika THERMO 5 click board, which can measure temperatures across four channels with ranges from 0 to 127ºC and extended range of -64 to 191ºC. Both The CEC1702Q-B2-I/SX and CEC1702 IoT development kit are available now.
Microchip – www.microchip.com