MagnaChip partnered with Yield Microelectronics Corporation (YMC) to develop the core. The core is coupled with MagnaChip’s 0.13 micron mixed signal and BCD technologies to provide customers with SoC performance for embedded MCUs capable of being programmed one thousand times.
NVM technology requires zero to two mask layers less than embedded Flash memory, and has a thousand-time programming/erasing capability. MagnaChip and YMC already have collaborated on MTP solutions in 0.35um to 0.18um tech nodes, and mass-produced a variety of products including MCUs, touch and power management ICs (PMICs).
The MTP solution for 0.13um mixed-signal has achieved 0.061mm2 1Kbits IP size and read/write operation range has been lowered to 1.65V. The MTP for 0.13um BCD technology provides high-density 16K*32 MTP + 1K EEPROM IP with ECC design and 40-nanosecond (ns) high-speed access time.