CMOS image sensor platform brings new features to industrial camera designs

March 13, 2018 // By Ally Winning
ON Semiconductor’s X-Class image sensor platform is designed for greater flexibility by supporting multiple product resolutions and different pixel functionalities.

The first members of the X-Class platform are 12 megapixel (MP) XGS 12000 and 4k / UHD resolution XGS 8000 image sensors, which have been designed for high performance imaging applications.

The platform allows the support of different CMOS pixel architectures in the same image frame. This technique allows developers to trade off resolution for higher sensitivity by using larger pixels. Solutions can also be developed to offer lower noise and higher dynamic ranges. The use of a single interface lets developers use existing parts, speeding time-to-market.

The XGS 12000 and XGS 8000 are based on a 3.2 µm global shutter CMOS pixel. The XGS 12000 has a 12 MP (4096 x 3072 pixel) resolution in a one-inch optical format, which will eventually come with either 90 fps through a 10GigE interface, or 27fps with USB 3.0 interface. The XGS 8000 has 4k / UHD (4096 x 2160 pixels) resolution in a 1/1.1 inch format and will be available in two speed grades (130 and 75 fps).

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