AEC-Q100 Qualified BLE Chip

December 07, 2017 // By Ally Winning
Toshiba Electronics Europe launched a new Bluetooth Low Energy (BLE) chip that is designed to work in harsh environments, including over extended temperature ranges.

The TC35679 IC is fully compliant with BLE core specification 4.2 and contains both the analogue RF and digital baseband components. The device can be use as an application processor or can be controlled by a host processor. The device is powered by an ARM Cortex-M0 processor backed up by 384kB ROM for baseband processing and an additional 192kB RAM to run applications.


The flexibility of the device is enhanced by multiple connectivity options. It has 17 GPIO lines, as well as SPI, I2C and a two-channel UART operating at up to 921.6kbs. The GPIO lines can be used to harness some of the internal features of the IC, which include PWM interface and a 6 channel ADC. The QFN packaged chip also features a DC/DC converter and LDO circuits.


Although the rugged chip can be used in many applications, it is primarily designed for the automotive industry, with the wettable flank package enabling the automotive requirement for 100% automatic visual inspection to ensure the solder is capable of enduring the high levels of vibration experienced in automotive applications.