3.5-in. CPU Board hosts Intel Skylake/Kaby Lake SoC

November 08, 2017 // By Graham Prophet
Embedded board maker ICP (Reutlingen, Germany) has introduced its WAFER-ULT series, based on one of a range of processors from the Intel Skylake and Kaby Lake series.

The CPU and graphics performance of the Intel platforms has increased by over 10% and 30%, respectively, with a maximum TDP figure of 15W. Of note is the integration of the cooling and mounting plate of the WAFER-ULT3 / ULT4. The special design of the mainboard allows the waste heat of soldered SoC, on the bottom of the board, to be discharged effectively and directly to the outside. This enables slim embedded systems to be implemented. Up to three independent displays can be connected for embedded display solutions. This is made possible by an HDMI (4K UHD resolution) and an LVDS interface as well as an internal DisplayPort (iDP). Via an optional adapter the iDP can be converted to HDMI or DP. The two PCIe Mini card slots can be used for expansions with WLAN, 3G / 4G or industrial mSATA modules. ICP Deutschland can also integrate an on-board 8 GB DDR4 SO-DIMM memory and provide the WAFER-ULT3 / ULT4 as a Ready-to-Use system.


Features include;

- 3.5-in. CPU board with combined cooling and mounting plate

- Intel 6./7 generation i7/i5/i3 or Celeron processor

- Max. 8 GB DDR4 SO-DIMM memory and 8 GB on-board memory (optional)

- USB, COM ports, SATA 6 Gb/sec, dual PCIe GbE

- Expansions: two full-size PCIe mini card slots with mSATA support or on-board SIM holder

- Triple independent displays: HDMI (4K UHD), LVDS and internal DisplayPort

- Power input: 12VDC

- Operating temperature: -20°C~+60°C


ICP Deutschland; www.icp-deutschland.de